SAP与硅灰复掺对水泥强度与电阻率的影响_《混凝土与水泥制品》杂志社

摘要：研究了高吸水树脂(SAP)和硅灰复掺对水泥浆体凝结时间、抗压强度、电阻率和温度等的影响。结果表明：SAP的掺入降低了试块的抗压强度，SAP掺量为0.4%时，随着硅灰掺量的增大，硬化水泥浆体的3 d抗压强度逐渐降低，但28 d抗压强度逐渐增大；SAP能延长水泥浆体的凝结时间，硅灰则缩短水泥浆体的凝结时间；不同掺量SAP和硅灰的水泥浆体电阻率变化曲线具有相同的变化趋势，SAP能明显降低水泥浆体12 h龄期后的电阻率，而硅灰能降低水泥浆体24 h龄期后的电阻率；随着SAP掺量的增加，水泥浆体内部温度峰值逐渐降低，而随着硅灰掺量的增加，水泥浆体内部温度峰值先增加后降低。

Abstract：The effects of super absorbent polymer (SAP) and silica fume on the setting time, compressive strength, electrical resistivity and temperature of cement paste were studied. The results show that the SAP reduces the compressive strength of the cement pastes, when the content of SAP is 0.4%, the 3 d compressive strength of hardened cement paste decreases gradually with the increase of silica fume, but the compressive strength of 28 d gradually increases. SAP can extend the setting time of the cement paste, but the silica fume can shorten the setting time of the cement paste. The electrical resistivity of cement paste with different SAP and silica fume content have the same trend with time, SAP can obviously reduce the electrical resistivity of cement paste after 12 h, the silica fume can reduce the electrical resistivity after 24 h. The maximum temperature inside the cement paste gradually decreases with the increase of the content of SAP, and which increases first and then decreases with the increase of silica fume content.

关键词:

硅灰；高吸水树脂；电阻率；温度；强度；凝结时间

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（1）SAP能延长水泥浆体的凝结时间，当 SAP掺量大于0.4%时，其掺量增加反而会缩短水泥浆体的凝结时间；硅灰不仅缩短了水泥浆体的凝结时间，而且还缩短了水泥浆体的凝结期。

（2）掺入SAP后，水泥浆体的3 d和28 d龄期抗压强度均降低，且随着SAP掺量的增加，强度降低程度越明显。在SAP掺量为0.4%时，掺入硅灰降低了试块3 d龄期的抗压强度，但能提高试块28 d龄期的抗压强度。

（3）不同SAP掺量的水泥浆体电阻率变化曲线和不同硅灰掺量的水泥浆体的电阻率变化曲线随时间都有相同的发展趋势，电阻率变化曲线先大致水平不变，然后随时间加速上升，最后缓慢上升趋于水平。在12 h龄期后，掺入SAP能明显降低水泥浆体的电阻率，在24 h龄期后，掺入硅灰能降低水泥浆体的电阻率，但与未掺硅灰组电阻率差值逐渐减小。掺入SAP能降低水泥浆体内部温度峰值，且随着SAP掺量的增加，水泥浆体内部温度峰值逐渐降低。硅灰掺量由0增加到5.0%，水泥浆体内部温度峰值先增加后降低。

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SAP与硅灰复掺对水泥强度与电阻率的影响

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