摘   要：探讨了材料类型、密度、含水率、测试温度等因素对硅酸钙板导热系数的影响。结果表明，硅酸钙板的结构类型不同，其导热系数会存在较大差别；密度越小，其孔隙率相对越大，导热系数值就会越小；导热系数随着含水率的增加出现先缓慢增加再迅速增加后趋于平稳的趋势；绝干或含水率较低情况下，其导热系数随着平均温度的升高而增大，且密度等级越低，增幅越大，但由于加热法测量导热系数的过程中存在湿分迁移效应，当含湿量超过一定值时（约8%～10%），测试平均温度越高，其导热系数反而越小。

Abstract: The effects of material type, density, moisture content, test temperature, etc. on thermal conductivity of calcium silicate board are studied. The results show that its thermal conductivity differs according to its structure and type. The smaller the density, the greater the relative porosity, which leads to the smaller thermal conductivity. The thermal conductivity increases slowly at first and then rapidly increases and last tends to be constant with the increase of moisture content. Under the condition of absolutely dry or low moisture content of the sample, the thermal conductivity increases with the increase of the average temperature, and the lower the density grade, the faster the growth of the thermal conductivity is. However, due to the moisture migration, the higher the average test temperature, the smaller its thermal conductivity is, when the moisture content exceeds a certain value (about 8% to 10%).