废弃线路板非金属残渣作填充料对镁质胶凝材料性能的影响
Influence of Non-metallic Residues of Waste Printed Circuit Board as Filling Material on Performance of Magnesium Oxychloride Ce
关键词:
废弃线路板;非金属残渣;镁质胶凝材料;水化过程;晶体形貌
Key words:
Waste printed circuit boards; Non-metallic residues; Magnesium oxychloride cement; Hydration process; Crystal morphology
刊期:
2017年第8期
DOI:
文章编号:
1000-4637(2017)08-87-04
基金项目:
作者:
王祖润,杜 中,张永贵,余学飞
单位:
中国建材检验认证集团安徽有限公司,合肥市环境监测站,230051)
摘要
摘 要:研究了废弃线路板非金属残渣对镁质胶凝材料的水化过程、抗压强度、镁质胶凝材料晶体形貌的影响,结合扫描电镜对其反应机理进行了分析。结果表明,非金属残渣能抑制镁质胶凝材料的早期水化,使水化放热减缓,早期水化率降低,凝结时间延长;非金属残渣对镁质胶凝材料晶体形貌影响较大,使镁质胶凝材料晶体尺寸明显增大;非金属残渣通过多种途径的作用对镁质胶凝材料产生了缓凝作用。当非金属残渣掺量超过15%时,抗压强度下降较大。
Abstract: The effect of non-metallic residues of waste printed circuit boards on the hydration process, compressive strength, and crystal morphology of magnesium oxychloride cement are investigated. By using the SEM, its retarding mechanism is also studied. The results indicate that the addition of non-metallic residues can lead to the delay in the hydration heat evolution. It can also decrease the hydration ratio at in the early stage and delay the prolong induction period of magnesium oxychloride cement. Non-metallic residues has a major effect on the crystal morphology of magnesium oxychloride cement, it can make the crystal sizes larger. Retardation to magnesium oxychloride cement is caused by a variety of ways with the non-metallic residues. When the content of non-metallic residue is more than 15%, the compressive strength decreases quickly.
结论
参考文献
引用本文
王祖润,杜中,张永贵,等.废弃线路板非金属残渣作填充料对镁质胶凝材料性能的影响[J].混凝土与水泥制品,2017(8):87-90.
WANG Z R, DU Z, ZHANG Y G,et al.Influence of Non-metallic Residues of Waste Printed Circuit Board as Filling Material on Performance of Magnesium Oxychloride Cement[J].China Concrete and Cement Products,2017(8):87-90.
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